Ultrasonic Soldering System
| You're looking at a photo of the System 35 that produces strong, non-porous bonds in a wide variety of materials - without using flux. |
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Fibra-Sonics Ultrasonic Soldering System consists of an automatically tuned power generator (G-35), the vibrator tool-head (T-35), soldering tips (H-2, H-3, H-4 or H5), and a footswitch.
Ultrasonic soldering applications include the semi-conductor and microwave fields and other fields un which the corrosive effects of fluxes are an ever-presenr problem. The fluxless principle is one of the best means for reducing corrosion and increasing the durability of soldered joints. High temperature applications, extremely troublesome with flux methods due to carbonization and corrosion, are solved by ultrasonic soldering.
One of the major applications of fluxless soldering is in the elimination of the cleaning, post treatment and neutralizing procedures necessary to remove the flux residue in normal solder operation.
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The following is a partial list of materials, which can be satisfactorily soldered without the use of flux:
| SOLDERABLE MATERIALS | Aluminum | Niobium |
| Ceramics | Nickel and its alloys | |
| Copper and its alloys | Semiconductor material | |
| Glass (including borsilicate glass) | Silicon | |
| Germanium | Silver | |
| Gold | Sodium Trichloride | |
| Lead | Steel | |
| Magnesium | Tin | |
| Zinc |
Soldering Tips
There are four types of tips:
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H-2 H-3 H-4 H-5 |
1/8" Cone shape 3/16" Pyramid shape 3/16" Chisel shape 1/4" Chisel shape |
MBR ELECTRONICS GmbH |